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J9集团-国际站最新官网
J9集团-国际站最新官网
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晶圆级封装（WLCSP）

概述

J9集团创新 SPI NOR Flash 和 SPI NAND Flash 提供 4Mb至 2Gb 的晶圆级封装（WLCSP ，Wafer Level Chip Scale Packaging）版本。与传统塑料封装不同 ，WLCSP 是一种晶圆级封装 ，其封装尺寸与裸芯片相同。J9集团最小 WLCSP 封装尺寸长度和宽度均可低于 1mm ，厚度仅 0.25mm ，为紧凑型电路板设计提供了显著的尺寸优势。同时 ，WLCSP 封装还可改善芯片的散热性能 ，提高数据传输的稳定性。 

从小型化到低功耗 ，J9集团创新通过 WLCSP 封装突破了存储器器件的物理限制 ，目前已被广泛应用于可穿戴设备等领域。随着微型化市场需求的发展 ，WLCSP 封装将继续成为当前及未来重要的封装形式之一。

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    40个结果

    • 电压

      • 1.2V

      • 1.65V~3.6V

      • 1.8V

      • 1.8V VCC, 1.2V VIO

    • 容量

      • 2Mb

      • 4Mb

      • 8Mb

      • 16Mb

      • 32Mb

      • 64Mb

      • 128Mb

      • 256Mb

      • 512Mb

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    Part No
    J9集团-国际站最新官网
    状态
    J9集团-国际站最新官网
    电压
    J9集团-国际站最新官网
    容量
    J9集团-国际站最新官网
    温度(工规)
    J9集团-国际站最新官网
    频率(MHz)
    J9集团-国际站最新官网
    主要特性
    J9集团-国际站最新官网
    主要封装
    MP1.8V512Mb-40℃~85℃,-40℃~105℃,-40℃~125℃200(x1 x8),200(x8 DTR)ECC,H/W RESET,WP#,Secured OTPSOP16 300mil,TFBGA24 5x5 ball array,WLCSP (4x6 ball array)
    MP1.2V256Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4),80(x4 DTR)Default 4I/O,H/W RESET,WP#,Secured OTPSOP8 208mil,SOP16 300mil,WSON8 6x5mm,WSON8 8x6mm,WLCSP (4-4 ball array)
    MP1.8V VCC, 1.2V VIO256Mb-40℃~85℃,-40℃~105℃,-40℃~125℃133(x1 x2 x4),104(x4 DTR)H/W RESET,Secured OTP,SuspendTFBGA24 5x5 ball array
    MP1.8V256Mb-40℃~85℃,-40℃~105℃,-40℃~125℃200(x1 x8),200(x8 DTR)ECC,H/W RESET,WP#,Secured OTPSOP16 300mil,TFBGA24 5x5 ball array,WLCSP (4x6 ball array)
    MP1.8V256Mb-40℃~85℃,-40℃~105℃,-40℃~125℃166(x1 x2 x4),104(x4 DTR)H/W RESET,WP#,Secured OTP,SuspendWSON8 6x5mm,WLCSP (4-4 ball array)
    MP1.2V128Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4),80(x4 DTR)Default 4I/O,H/W RESET,WP#,Secured OTPSOP8 208mil,USON8 4x4mm,WSON8 6x5mm,TFBGA24 5x5 ball array,WLCSP (4-4 ball array)
    MP1.65V~3.6V128Mb-40℃~85℃,-40℃~105℃,-40℃~125℃104(x1 x2 x4),66(x4 DTR)H/W RESET,WP#,Secured OTP,SuspendSOP8 150mil,SOP8 208mil,USON8 3x4mm,USON8 4x4mm,WSON8 6x5mm,WLCSP (4-4 ball array)
    MP1.8V128Mb-40℃~85℃,-40℃~105℃,-40℃~125℃133(x1 x2 x4)H/W RESET,WP#,Secured OTP,SuspendSOP8 150mil,SOP8 208mil,SOP16 300mil,USON8 4x4mm,WSON8 6x5mm,WSON8 8x6mm,TFBGA24 5x5 ball array
    MP1.8V128Mb-40℃~85℃,-40℃~105℃,-40℃~125℃133(x1 x2 x4),104(x4 DTR)H/W RESET,WP#,Secured OTP,SuspendVSOP8 208mil,SOP8 208mil,FO-USON8 3x3mm,USON8 3x3mm,USON8 4x4mm,WSON8 6x5mm,WSON8 8x6mm,WLCSP (4-4 ball array)
    MP1.2V64Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4),80(x4 DTR)Default 4I/O,H/W RESET,WP#,Secured OTPSOP8 208mil,USON8 3x4mm,USON8 4x4mm,WLCSP (4-4 ball array)
    MP1.65V~3.6V64Mb-40℃~85℃,-40℃~105℃,-40℃~125℃104(x1 x2 x4)WP#,Secured OTP,SuspendSOP8 208mil,USON8 3x4mm,USON8 4x4mm,WSON8 6x5mm,TFBGA24 5x5 ball array,WLCSP (3-2-3 ball array)
    MP1.65V~3.6V64Mb-40℃~85℃,-40℃~105℃,-40℃~125℃104(x1 x2 x4),66(x4 DTR)H/W RESET,WP#,Secured OTP,SuspendSOP8 150mil,SOP8 208mil,FO-USON8 3x2mm,USON8 3x2mm,USON8 3x4mm,USON8 4x4mm,WSON8 6x5mm,WLCSP (4-4 ball array)
    MP1.8V64Mb-40℃~85℃,-40℃~105℃,-40℃~125℃133(x1 x2 x4),104(x4 DTR)WP#,Secured OTP,SuspendSOP8 150mil,SOP8 208mil,FO-USON8 3x2mm,USON8 3x2mm,USON8 3x4mm,USON8 4x4mm,WLCSP (4-4 ball array),WSON8 6x5mm
    MP1.8V64Mb-40℃~85℃,-40℃~105℃,-40℃~125℃166(x1 x2 x4),104(x2 x4 DTR)WP#,Secured OTP,SuspendSOP8 150mil,SOP8 208mil,FO-USON8 3x2mm,USON8 3x2mm,USON8 3x4mm,USON8 4x4mm,WLCSP (4-4 ball array)
    MP1.2V32Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4),80(x4 DTR)Default 4I/O,H/W RESET,WP#,Secured OTPSOP8 150mil,SOP8 208mil,USON8 3x2mm,USON8 3x4mm,WLCSP (3-2-3 ball array)
    MP1.8V32Mb-40℃~85℃,-40℃~105℃,-40℃~125℃133(x1 x2 x4)WP#,Secured OTP,SuspendSOP8 150mil,SOP8 208mil,USON8 3x2mm,USON8 3x4mm,USON8 4x4mm,WSON8 6x5mm
    MP1.8V32Mb-40℃~85℃,-40℃~105℃,-40℃~125℃133(x1 x2 x4),104(x4 DTR)WP#,Secured OTP,SuspendUSON8 3x2mm,USON8 3x4mm,USON8 4x4mm,WLCSP (3-2-3 ball array),WLCSP (4-4 ball array)
    MP1.2V16Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4),80(x4 DTR)Default 4I/O,H/W RESET,WP#,Secured OTPSOP8 150mil,SOP8 208mil,USON8 3x2mm,USON8 3x4mm,WLCSP (3-2-3 ball array)
    MP1.8V16Mb-40℃~85℃,-40℃~105℃,-40℃~125℃133(x1 x2 x4)WP#,Secured OTP,SuspendSOP8 150mil,SOP8 208mil,USON8 3x2mm,USON8 3x4mm,WSON8 6x5mm,WLCSP (3-2-3 ball array)
    MP1.8V16Mb-40℃~85℃,-40℃~105℃,-40℃~125℃133(x1 x2 x4),104(x4 DTR)WP#,Secured OTP,SuspendSOP8 208mil,USON8 3x2mm,WLCSP (3-2-3 ball array)
    MP1.2V8Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4),80(x4 DTR)Default 4I/O,H/W RESET,WP#,Secured OTPSOP8 150mil,SOP8 208mil,USON8 3x2mm,WLCSP (4-4 ball array)
    MP1.8V8Mb-40℃~85℃,-40℃~105℃,-40℃~125℃133(x1 x2 x4),104(x4 DTR)WP#,Secured OTP,SuspendSOP8 150mil,USON8 3x2mm,WLCSP (4-4 ball array)
    MP1.65V~3.6V4Mb-40℃~85℃,-40℃~105℃,-40℃~125℃104(x1 x2 x4)WP#,Secured OTP,SuspendSOP8 150mil,USON8 1.5x1.5mm,USON8 3x2mm,WLCSP (4x6 ball array)
    MP1.65V~3.6V2Mb-40℃~85℃,-40℃~105℃,-40℃~125℃104(x1 x2 x4)WP#,Secured OTP,SuspendSOP8 150mil,USON8 1.5x1.5mm,USON8 3x2mm,WLCSP (2x3 ball array)
    UD1.8V32Mb-40℃~85℃,-40℃~105℃,-40℃~125℃166(x1 x2 x4),104(x2 x4 DTR)WP#,Secured OTP,SuspendSOP8 150mil,SOP8 208mil,USON8 3x2mm,USON8 3x4mm,WLCSP (3-2-3 ball array)
    NR1.8V512Mb-40℃~85℃,-40℃~105℃,-40℃~125℃166(x1 x4),90(x4 DTR)Default 4I/O,H/W RESET,WP#,Secured OTPSOP16 300mil,WSON8 8x6mm,TFBGA24 5x5 ball array,WLCSP (3-2-3 ball array)
    NR1.8V256Mb-40℃~85℃,-40℃~105℃,-40℃~125℃166(x1 x4),104(x4 DTR)Default 4I/O,H/W RESET,WP#,Secured OTPWSON8 6x5mm,WSON8 8x6mm,TFBGA24 5x5 ball array,WLCSP (3-2-3 ball array),WLCSP (4-4 ball array)
    NR1.8V256Mb-40℃~85℃,-40℃~105℃,-40℃~125℃166(x1 x2 x4),104(x4 DTR)Default 4I/O,H/W RESET,Secured OTP,SuspendWSON8 6x5mm,WLCSP (4-4 ball array)
    NR1.8V256Mb-40℃~85℃,-40℃~105℃,-40℃~125℃133(x1 x2 x4)H/W RESET,WP#,Secured OTP,SuspendWSON8 6x5mm,WLCSP (4-4 ball array)
    NR1.8V128Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4)WP#,Secured OTP,SuspendVSOP8 208mil,SOP8 208mil,WSON8 6x5mm,WSON8 8x6mm,WLCSP (4-4 ball array)
    NR1.8V128Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4)Default 4I/O,Secured OTP,SuspendVSOP8 208mil,SOP8 208mil,WSON8 6x5mm,WLCSP (4-4 ball array)
    NR1.8V32Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4)WP#,Secured OTP,SuspendVSOP8 208mil,SOP8 208mil,USON8 3x4mm,USON8 4x4mm,WSON8 6x5mm,WLCSP (4-4 ball array)
    NR1.8V32Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4)WP#,Secured OTP,SuspendVSOP8 208mil,SOP8 208mil,USON8 3x4mm,USON8 4x4mm,WSON8 6x5mm,WLCSP (4-4 ball array)
    NR1.8V32Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4)Default 4I/O,Secured OTP,SuspendVSOP8 208mil,SOP8 208mil,USON8 3x4mm,USON8 4x4mm,WSON8 6x5mm,WLCSP (4-4 ball array)
    NR1.8V16Mb-40℃~85℃,-40℃~105℃,-40℃~125℃104(x1 x2 x4)WP#,Secured OTP,SuspendVSOP8 150mil,VSOP8 208mil,SOP8 150mil,SOP8 208mil,USON8 3x3mm,USON8 3x4mm,USON8 4x4mm,WSON8 6x5mm,LGA8 3x2mm,WLCSP (4-4 ball array)
    NR1.8V16Mb-40℃~85℃,-40℃~105℃,-40℃~125℃104(x1 x2 x4)WP#,Secured OTP,SuspendVSOP8 150mil,VSOP8 208mil,SOP8 150mil,SOP8 208mil,USON8 3x3mm,USON8 3x4mm,USON8 4x4mm,WSON8 6x5mm,LGA8 3x2mm,WLCSP (4-4 ball array)
    NR1.8V8Mb-40℃~85℃,-40℃~105℃,-40℃~125℃104(x1 x2 x4)WP#,Secured OTP,SuspendVSOP8 150mil,VSOP8 208mil,SOP8 150mil,SOP8 208mil,USON8 3x2mm,USON8 3x2mm (0.55mm),USON8 3x4mm,USON8 4x4mm,WSON8 6x5mm,WLCSP (4-4 ball array)
    NR1.8V8Mb-40℃~85℃,-40℃~105℃,-40℃~125℃104(x1 x2 x4)WP#,Secured OTP,SuspendVSOP8 150mil,VSOP8 208mil,SOP8 150mil,SOP8 208mil,USON8 3x2mm,USON8 3x4mm,USON8 4x4mm,WSON8 6x5mm,WLCSP (4-4 ball array)
    NR1.65V~3.6V4Mb-40℃~85℃,-40℃~105℃,-40℃~125℃100(x1),80(x2)WP#SOP8 150mil,SOP8 208mil,USON8 1.5x1.5mm,USON8 3x2mm,WLCSP (4-4 ball array)
    NR1.65V~3.6V2Mb-40℃~85℃,-40℃~105℃,-40℃~125℃100(x1),80(x2)WP#SOP8 150mil,SOP8 208mil,USON8 1.5x1.5mm,USON8 3x2mm,WLCSP (4-4 ball array)

    状态说明：MP：量产阶段 ，UD：开发中 ，S：样品阶段 ，NR：不推荐

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